Ecosyste.ms: Issues
An open API service for providing issue and pull request metadata for open source projects.
GitHub / sqfmi/beepy-hardware issues and pull requests
#25 - Gerber and Boom
Issue -
State: open - Opened by clarax98 3 months ago
#24 - Place for LTE module
Issue -
State: open - Opened by wowatatarin about 1 year ago
- 1 comment
#23 - Rename description
Issue -
State: closed - Opened by dezren39 over 1 year ago
- 1 comment
#22 - The slim case's thickness is too thin
Issue -
State: open - Opened by dishangti over 1 year ago
#21 - feat: add slide cover stl with readme
Pull Request -
State: closed - Opened by vderm over 1 year ago
- 1 comment
#20 - Slim case — Lower front two screw holes do not fit the screw part suggested
Issue -
State: closed - Opened by jogloran over 1 year ago
- 3 comments
#19 - Add a piezo element for audio in Rev A HW
Issue -
State: open - Opened by 57Bravo over 1 year ago
- 2 comments
#18 - Add a clear qwerty key mapping to docs
Issue -
State: closed - Opened by 57Bravo over 1 year ago
- 3 comments
#17 - V1 Case needs a power slide button
Issue -
State: closed - Opened by 57Bravo over 1 year ago
- 5 comments
#16 - Add back case with SD card access
Pull Request -
State: closed - Opened by a8ksh4 over 1 year ago
- 1 comment
#15 - Misc hardware notes
Issue -
State: open - Opened by jamesmunns over 1 year ago
- 2 comments
#14 - Make display modular in V2
Issue -
State: open - Opened by 57Bravo over 1 year ago
#13 - Create a CM4 carrier for V2
Issue -
State: open - Opened by 57Bravo over 1 year ago
- 1 comment
#12 - Expansion I/O mechanically interferes with SDCARD/MIPI jacks
Issue -
State: open - Opened by 57Bravo over 1 year ago
- 3 comments
#11 - Add prototyping area to PCB
Issue -
State: open - Opened by sockbot over 1 year ago
#10 - added rev6 models
Pull Request -
State: closed - Opened by a8ksh4 over 1 year ago
#9 - Added a case design
Pull Request -
State: closed - Opened by a8ksh4 over 1 year ago
- 1 comment
#8 - Create a LoRa transceiver add-on in v2
Issue -
State: open - Opened by 57Bravo over 1 year ago
- 6 comments
Labels: enhancement
#7 - Flip the RPI in v2 and use ground plane to heat sink the CPU
Issue -
State: open - Opened by 57Bravo over 1 year ago
#6 - Consolidate expansion I/O into single stackable header in v2
Issue -
State: open - Opened by 57Bravo over 1 year ago
- 2 comments
Labels: enhancement
#5 - Publish 3D models for v1 enclosure in STEP or IGES format
Issue -
State: closed - Opened by 57Bravo over 1 year ago
- 2 comments
#4 - Add space in the enclosure for gpio daughter cards
Issue -
State: open - Opened by 57Bravo over 1 year ago
Labels: enhancement
#3 - Create an enclosure case for TPU prints
Issue -
State: open - Opened by 57Bravo over 1 year ago
- 2 comments
#2 - Add kicad files
Issue -
State: closed - Opened by 57Bravo over 1 year ago
- 2 comments
#1 - Add a space for the rear case to accept an RPi camera
Issue -
State: open - Opened by sockbot over 1 year ago
- 2 comments
Labels: enhancement